and Solid State Physics
Successful Participtaion at BMBF Call “ForLab”
20 April 2019
Together with Prof. Hoc Khiem Trieu (TUHH) and Prof. Wolfgang Hansen (CHyN, UHH) we successfully participated at the BMBF Call “Forschungslabore Mikroelektronik Deutschland (ForLab)”.
The delivery of two E-Beam Raith Voyager-AddOns and a new EVG wafer bonder are already scheduled for May. Our new III-V-ICP-RIE by SENTECH is going to be installed before summer.

